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Products:
Plastic Ball Grid Arrays
Chip-Scale-Packages
Ultra-thin Micro-CSP
Chip-on-Boards (COB)
RF Modules
Memory Modules
System-on-Package Modules
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Microcircuit Technology
Ultra-thin Micro-CSP
- 2 layer, 4 layer
- microvias of min 0.10mm
- min bond pitch of 130um with min 65um finger top
- solder ball pitch 0.50mm
- min thickness 0.06mm core
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Copyright ©2003
Microcircuit Technology (S) Pte Ltd. All
Rights Reserved.
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