Products:
Plastic Ball Grid Arrays Chip-Scale-Packages Ultra-thin Micro-CSP Chip-on-Boards (COB) RF Modules Memory Modules System-on-Package Modules
Chip-Scale-Packages
Ultra-thin Micro-CSP
Chip-on-Boards (COB)
RF Modules
Memory Modules
System-on-Package Modules
System-on-Package Modules (flip chip, wire bond die, passives)
- 2 layer, 4 layer and 6 layers - flip chip bump pitch of 250 um - blind and buried microvias of min 0.10mm - selective plating - Flip Chip and Passive : ENIG finishing
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