Products:

Plastic Ball Grid Arrays

Chip-Scale-Packages

Ultra-thin Micro-CSP

Chip-on-Boards (COB)

RF Modules

Memory Modules

System-on-Package Modules

RF Modules - 2 layer, 4 layer - thick copper wall microvias of min 0.2mm - Via on Pad - tie-barless plating - low dielectric material

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