Products:
Plastic Ball Grid Arrays Chip-Scale-Packages Ultra-thin Micro-CSP Chip-on-Boards (COB) RF Modules Memory Modules System-on-Package Modules
Chip-Scale-Packages
Ultra-thin Micro-CSP
Chip-on-Boards (COB)
RF Modules
Memory Modules
System-on-Package Modules
Memory Modules (CF,MMC)
- 2 layer, 4 layer layers - microvias of min 0.15mm - bondable gold or ENIG finish - customised solder mask - min thickness 0.15mm core
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