Products:

Plastic Ball Grid Arrays

Chip-Scale-Packages

Ultra-thin Micro-CSP

Chip-on-Boards (COB)

RF Modules

Memory Modules

System-on-Package Modules

Chip-on-Boards (COB) - 2 layer, 4 layer 6 layers - min 0.20mm - min Aluminium bond pitch of 120um - Electroless Nickel- Immersion Au - max thickness 0.8mm core

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