Products:

Plastic Ball Grid Arrays

Chip-Scale-Packages

Ultra-thin Micro-CSP

Chip-on-Boards (COB)

RF Modules

Memory Modules

System-on-Package Modules

Chip-Scale-Packages - 2 layer, 4 layer - microvias of min 0.15mm - min bond pitch of 140um with min 70um finger top - solder ball pitch 0.80mm, 0.75mm, 0.65mm - min thickness 0.15mm core

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