Technical
Capabilities

Quality and
Reliability

Technical Capabilities

Strong technology solution provider to support the semiconductor substrate technology roadmap

Pattern :	Minimum 40um trace and gap
Micro Via :	Minimum 100 um
Finished Thickness :	Minimum 0.18mm for 2 layer
No of Layers :	Multi-layers
Finishing :	Gold wire bondable Ni-Au, Aluminium and Flip Chip Electroless Ni-Au
Special features :	Tiebarless, Via-on-pads, Selective Plating

Photo-Image Pattern	Solder Resist Print	Multilayer Press

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